RF Design Team Improves Simulation Depth By Up to 16x, Minimizes Tapeout Risks2010-04-08 Author: Paul Buckley From: Microsave Engineering Magazine Rohde & Schwarz, a market leader in complex RF test and measurement products, has improved the quality and functionality of its complex RF integrated circuits (RFICs) through an increased simulation depth using Cadence Virtuoso Accelerated Parallel Simulator (APS). Hyperlink to Original Source
Stimulus Wishes and Broadband Dreams2010-04-07 Author: Rich Karpinski From: Connected Planet Magazine It's an old adage that you don't want to see two things get made: laws and sausage. They're both just too messy. In telecom, you can add a third, and given this industry's regulatory complexity and the fact that billions of dollars are up for grabs, it should be no surprise things did indeed get mes Hyperlink to Original Source
A Long Sought After Dream Technology2010-04-07 Author: Oh Hae-young From: Korea IT Times The Korean research team, led by Dr. Oh Hyeon-seok, has successfully developed the much sought-after core technology for producing cylindrical nano molds that are needed for next-generation semiconductors and displays. This state-of-the-art technology, developed by the Korea Electrotechnology Resear Hyperlink to Original Source
Labeller integrated in SMD placer2010-04-06 Author: Electronics Manufacture & Test Magazine Staff From: Electronics Manufacture & Test Magazine SMD assembly systems from Essemtec can now mark the PCB with an identification label while placing components. The integrated labeller delivers on demand a label with bar code, matrix code, date or serial numbers. Consistent quality assurance and traceability in electronics manufacturing requires th Hyperlink to Original Source
Hardwired Logic2010-04-05 Author: David Wilson From: The Engineer Magazine To create any electronic system, design engineers must first precisely define the function that they wish that system to perform. Only once that definition is complete, can a design team go about the business of choosing the optimum circuitry on which to implement their concept. Years ago, that next Hyperlink to Original Source
TNO Uses RFID to Track Its Assets2010-04-02 Author: Claire Swedberg From: RFID Journal TNO, a Netherlands research company based in Delft, serves as a "knowledge broker" for government agencies, small and midsize enterprises, and commercial businesses. The organization helps its clients to develop better products, and also provides recommendations regarding policy and processes. "We a Hyperlink to Original Source
Wide Band Recording and Playback Enhances Signal Detection and Monitoring Systems2010-04-01 Author: Ken Owens, CEO Conduant Corp From: Electronic Technology & Products Traditionally, the actual storage in signal detection systems is very limited, if non-existent. The addition of massive ultra high-speed recording and playback capability expands the utility of these systems and permits a wide variety of detection scenarios both during signal capture and in post cap Hyperlink to Original Source
System or technology dictates ADC choice2010-03-31 Author: Bonnie Baker From: EDN How do you decide which ADC technology to use in your applications before you do a thorough system evaluation? Maybe you prefer SAR (successive-approximation-register) ADCs because you assume they are easy to use and a bit faster than delta-sigma converters. Then again, you may select delta-sigma co Hyperlink to Original Source
Nanotube RFID: Better Barcodes?2010-03-30 Author: Prachi Patel From: Electronics for You Magazine Radio-frequency identification (RFID) tags have made paying toll fees and public transit fares a breeze. But the tags, which are made of silicon, are still too expensive to replace ubiquitous barcodes to similarly speed up grocery store checkout lines by remotely scanning a product while it's still Hyperlink to Original Source
Printed, flexible integrated circuits in real-world applications2010-03-29 Author: ElectroIQ Staff From: ElectroIQ For 40 years, integrated circuits (ICs) have integrated little more than transistors, diodes and sensors onto one piece of material. Now, with innovative package design, there are more integrated circuits arriving where most electrical and electronic components are co-deposited on flexible substrate Hyperlink to Original Source
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