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Penn State Synthesizes Graphene Wafer 2010-03-15
Author: Alexander Braun
From: Semiconductor International
Researchers in the Electro-Optics Center (EOC) Materials Division at Pennsylvania State University have produced 100 mm diameter graphene wafers, a development considered to be a critical milestone in the development of graphene for high-frequency electronic devices.
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DARPA sets sights on revolutionary advancements in non-volatile logic IC technology 2010-03-12
Author: John Keller
From: Military & Aerospace Electronics
Military microelectronics experts at the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., are launching a leap-ahead technology program to develop advanced, ultra-low-power non-volatile logic integrated circuits that retain their data and computational states when power is r
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Embedded Die Technology Gains Support 2010-03-11
Author: Sally Cole Johnson, Contributing Editor
From: Semiconductor International
With the semiconductor industry looking for more ways to shrink form factors, active die embedding is turning into a real market with volume potential. Embedded die technology isn't new and has been in small-volume production since 2007, driven primarily by a few Japanese players,
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Long-range FM Transmitter 2010-03-10
Author: Electronics for You Staff
From: Electronicsforu.com
Several circuits for constructing FM transmitters have been published in EFY. The power output of most of these circuits are very low because no power amplifier stages were incorporated. The transmitter circuit described here has an extra RF power amplifier stage, after the oscillator stage, to rais
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Circuit lets you test sample-and-hold amplifiers 2010-03-08
Author: Martin Rowe, Fran Granville
From: EDN
Sample-and-hold amplifiers sample an analog voltage and hold it until an ADC can digitize it. A perfect sampling circuit holds a voltage until digitizing is complete. Thus, the amplifier’s output is identical to its input. Real sample-and-hold amplifiers, however
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Global Solar Energy's Thin-Film CIGS Achieves Record Efficiency 2010-03-05
Author: PV Society.com Staff
From: PV Society.com
A module produced by Global Solar Energy has been certified by the Department of Energy's National Renewable Energy Laboratory to have a 13.2% aperture area efficiency. Global Solar Energy (Tucson, Ariz.), a manufacturer specializing in thin-film CIGS solar cells and modules, has announced
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3-D architecture promises new type of PLD 2010-03-02
Author: Dylan McGrath
From: EETimes
Startup Tabula Inc. Monday (March 1) made public details about its three-dimensional programmable logic architecture, which the company says will enable a new class of devices, 3PLDs, that offer the capability of an ASIC, ease of use of an FPGA and price points suitable for volume production.
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Thin, flexible printed batteries power 'greener' products 2010-02-23
Author: Matt Ream
From: Electronic Technology & Products
Many industry analysts are projecting that the recent commercialization of printed electronics technology is likely to revolutionize major segments of the portable electronics industry. Printed electronics is the printing of electronic devices on common
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RFID Keeps Sweet Stuff Rolling at Spanish Refinery 2010-02-18
Author: Mary Catherine O'Connor
From: RFID Journal
Azucarera Ebro, a leading sugar manufacturer in Spain and part of the British Sugar Group—the second largest sugar producer in the world—is employing radio frequency identification to gain better visibility into, and control over, its operations at a refinery
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Experts: Car electronics to become complex commodity 2010-02-17
Author: Christoph Hammerschmidt
From: EETimes
Which type of motor will suit best future mobility requirements against the background of tighter climate gas emission regulations? This question is fiercely discussed within the automotive industry: While the traditionalist faction believes that conventional combustion engines still offer a large p
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